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 NCV7702B 1 A Dual H-Bridge Driver
This dual full-bridge driver IC is intended for 14 V automotive stepper and DC motor applications. Its four half-bridge outputs are configured as two channels and are programmed by six TTL compatible inputs, allowing flexible control of bridge operation. The device operates in standby mode, run mode, or brake mode and typically consumes less than 1 mA while in standby. In run mode, each half-bridge output can deliver load current in either direction. Brake mode activates the low side transistors or high side transistors at the selected outputs. On-chip recirculation diodes are provided, and the IC has multiple fault protection modes. Overcurrent detection protects against shorted loads between outputs and shorts to supply or ground at each output. An overcurrent fault condition activates an internal timer, which modulates faulted outputs at low duty cycle. An overcurrent condition in one channel does not affect operation in the other. Overvoltage and overtemperature detection are also provided, and turn off all bridge outputs during these fault conditions. Recovery from all fault conditions is automatic; the IC will resume normal operation in its previously selected mode upon fault resolution. Diagnostic ability is provided by two open-collector STATUS outputs which report the fault status of each channel independently during overcurrent faults, and together during overvoltage or overtemperature faults.
Features
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SO-24L DW SUFFIX CASE 751E 1
24
MARKING DIAGRAM
24 NCV7702B AWLYYWWG 1 A WL YY WW G = Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Device
* Single 7 V-16 V Supply * Low Standby Current: * * * * *
PIN CONNECTIONS
VB1 OUT1B OUT1A STATUS1 PGND PGND PGND PGND IN1A IN1B AGND EN1 1 24 VB2 OUT2B OUT2A STATUS2 PGND PGND PGND PGND IN2A IN2B CT EN2
* * *
< 1.0 mA Typically 3.3 V / 5 V Compatible Inputs Independent Channel Enable Channels Configurable as: Full-Bridge Drive Half-Bridge, High Side or Low Side Drive On-Chip Recirculation Diodes Fault Protection with Automatic Recovery for: Overcurrent Overvoltage Overtemperature Fault Diagnostic STATUS Outputs Internally Fused Leads in SO-24L Package These are Pb-Free Devices
ORDERING INFORMATION
Device NCV7702BDWG Package SO-24L (Pb-Free) Shipping 31 Units/Rail
Applications
* Automotive and Industrial Driver for:

NCV7702BDWR2G
SO-24L 1000 Tape & Reel (Pb-Free)
DC or Stepper Motors Relays or Solenoids Unipolar or Bipolar Loads
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2005
1
December, 2005 - Rev. 0
Publication Order Number: NCV7702B/D
NCV7702B
STATUS1 OUT1A VB1 OUT1B Overvolt. Bandgap Regulator Overtemp. OUT2A VB2 OUT2B STATUS2
VBG OV OT OC
VBG
OC
Half-Bridge Control
Half-Bridge Control
Overcurrent Duty Cycle
OC
OC
OV OT
OV OT
PGND PGND PGND PGND EN1 IN1A IN1B
CT
AGND
IN2B IN2A EN2 PGND PGND PGND PGND
Figure 1. Block Diagram MAXIMUM RATINGS
Rating Power Supply Voltage, VB Peak Transient Voltage (46 V Load Dump @ VB = 14 V) Logic Inputs & Status Outputs Junction Temperature, TJ Storage Temperature Range Package Thermal Resistance: Junction-to-Case, RqJC Junction-to-Ambient, RqJA ESD Capability Human Body Model Machine Model Value -0.5 to 30 60 -0.3 to 7.0 150 -65 to 150 9 55 2.0 200 260 peak 3 Unit V V V C C C/W C/W kV V C -
Peak Reflow Soldering Temperature (60 to 150 seconds at 217C) (Note 1) Moisture Sensitivity Level (MSL)
Maximum Ratings are those values beyond which damage (latent or otherwise) to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum-rated conditions is not implied. Voltages are with respect to device substrate. 1. For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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2
Half-Bridge Control
Half-Bridge Control
NCV7702B
ELECTRICAL CHARACTERISTICS (7.0 V v VB v 16 V, -40C v TJ v 125C; unless otherwise specified.) Notes 2 and 3.
Characteristic General Characteristics Quiescent Current Standby Mode, VB 12.8 V Run Mode, IOUT = 750 mA, Both Channels - - 1.0 - 10 40 mA mA Test Conditions Min Typ Max Unit
Logic Inputs High Level Input Voltage, VIH Low Level Input Voltage, VIL INX Input Current ENX Input Current ENX Delay, tPE Status Outputs Saturation Voltage, VSL Leakage Current Half-Bridge Driver Outputs Total Output Saturation Voltage Output Saturation Voltage High Output Saturation Voltage Low Output Leakage Overcurrent Threshold, IOC Overcurrent Duty Cycle Switching Delay, tPI Sink to Source Source to Sink Dead Band Time, tDB Recirculation Diode Forward Voltage Delay Timer Charge Current, ICHG Discharge Current, IDCH Input Threshold High, VCH Input Threshold Low, VDC Global Fault Protection Overtemperature Detection Threshold Overtemperature Hysteresis Overvoltage Detection Threshold Overvoltage Hysteresis Note 7 Note 7 Note 8 - 150 - 26 500 - 15 28 850 210 - 30 1200 C C V mV - - - - -85 1.25 1.85 200 -65 2.0 2.0 300 -45 3.25 2.15 400 mA mA V mV IOUT = 750 mA, Each Channel IOUT = 750 mA, VB - VOUT, Each Driver IOUT = 750 mA, VOUT - VPGND, Each Driver VOUT = VB VOUT = VPGND Low Side, Each Channel High Side, Each Channel 470 pF CT 1500 pF; Note 5 50% of INX to 60% of OUTX; Note 6 50% of INX to 40% of OUTX; Note 6 Note 6 IDIODE = 750 mA - - - - -5.0 0.9 0.775 3.0 0.20 0.20 0.10 - 2.5 1.25 1.25 0 0 1.25 0.900 4.0 - - - - 3.0 1.6 1.6 5.0 - 1.6 1.10 6.0 14 10 10 2.5 ms V V V V mA mA A % ms ISTATUS = 4.0 mA VSTATUS = 5.0 V - - - - 0.4 10 V mA VIN = 5.0 V VIN = 0 V VIN = 5.0 V VIN = 0 V 50% of ENX to 50% of OUTX; Note 4 Turn ON Turn Off - - 2.0 - - -5.0 - -5.0 - - - - 0 0 130 0 - - - 0.8 5.0 - 200 5.0 25 60 V V mA mA mA mA ms
2. Designed to meet these characteristics over the stated voltage and temperature recommended operating ranges, though may not be 100% parametrically tested in production. 3. Operation is guaranteed down to VB = 6.0 V. Electrical characteristics may be outside the limits at that voltage. 4. See Figures 2 and 3; VB = 14 V, R = 100 W. 5. CT must remain in this range to guarantee proper operation, and to ensure part integrity, during hard short conditions. 6. See Figures 2 and 4; VB = 14 V, R = 100 W. 7. Guaranteed by design. 8. Consult factory for no overvoltage detection or lower overvoltage detection threshold options.
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3
NCV7702B
PACKAGE PIN DESCRIPTION
PACKAGE PIN # 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 PIN SYMBOL VB1 OUT1B OUT1A STATUS1 PGND PGND PGND PGND IN1A IN1B AGND EN1 EN2 CT IN2B IN2A PGND PGND PGND PGND STATUS2 OUT2A OUT2B VB2 FUNCTION Power supply input voltage; overvoltage detection occurs at this pin. Half-bridge output controlled by IN1B. Half-bridge output controlled by IN1A. Diagnostic output; reports channel #1 fault condition. Power supply return. Power supply return. Power supply return. Power supply return. Logic level input. Logic level input. Analog supply return; reference for external CT capacitor, device substrate. Enable for OUT1A and OUT1B. Enable for OUT2A and OUT2B. External capacitor; sets overcurrent delay time and duty cycle. Logic level input. Logic level input. Power supply return. Power supply return. Power supply return. Power supply return. Diagnostic output; reports channel #2 fault condition. Half-bridge output controlled by IN2A. Half-bridge output controlled by IN2B. Power supply input voltage.
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4
NCV7702B
INPUT LOGIC TABLE
EN1 = EN2 = 0 = Standby Mode Channel #1 EN1 1 1 1 1 0 NOTE: IN1A 0 0 1 1 X IN1B 0 1 0 1 X OUT1A Low Low High High |Z| OUT1B Low High Low High |Z| Mode Brake Low Run Run Brake High Off EN2 1 1 1 1 0 IN2A 0 0 1 1 X IN2B 0 1 0 1 X Channel #2 OUT2A Low Low High High |Z| OUT2B Low High Low High |Z| Mode Brake Low Run Run Brake High Off
X = Don't Care; |Z| = Output Off.
STATUS OUTPUT TABLE
STATUS1 1 0 1 0 STATUS2 1 1 0 0 No Fault. Channel 1 Overcurrent; Note 9 Channel 2 Overcurrent; Note 9 Overvoltage, Overtemperature or Overcurrent in Both Channels; Notes 9 and 10 Fault Diagnostic
9. During overcurrent, the STATUS outputs will be modulated at the overcurrent duty cycle rate. See Figure 5. 10. During overtemperature, the STATUS outputs will be modulated by the thermal time constants. +14 V
1
24
VB1 R OUTX R OUT1B OUT1A STATUS1 PGND
VB2 OUT2B OUT2A STATUS2 PGND
PGND PGND NCV7702B PGND PGND PGND INX IN1A IN1B AGND
12
PGND IN2A IN2B CT
13
ENX
EN1
EN2
Figure 2. Propagation Delay and Dead Band Timing Test Circuit
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5
NCV7702B
VIH ENX VIL tPE ON
OUTX OFF T
Figure 3. ENX Propagation Delay
VIH INX VIL tPI VSRC tPI
OUTX
1/2VB
60% 40%
VSNK tDB tDB T
Figure 4. OUTX Propagation Delay and Dead Band Timing
STATUSX
VSH VSL IOC ION
OUTX OFF CT VCH VDC 0 T tOFF tON
Figure 5. Overcurrent, Status and Duty Cycle Timing
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6
NCV7702B
Functional Description The NCV7702B is arranged as four half-bridge drivers in two independent channels. Each channel can be operated as a full-bridge or half-bridge to drive multiple load configurations. Separate ENable inputs are used to control which channel is active. Each ENable input has a nominal 50 kW internal pull-down resistor to ensure that the outputs remain off during power-up. The four INX control inputs address each half-bridge output, and each output follows the state of its input. When INX is at logic one, OUTX is sourcing current from the VB supply; when INX is at logic zero, OUTX is sinking current to the PGND return. Half-Bridge Drivers The half-bridge drivers of each OUTX are comprised of an NPN Darlington driver on the low-side and a compound PNP-NPN driver on the high-side. Each half-bridge driver is capable of 1 A (min) peak current and is overcurrent protected against load and system faults. Cross conduction currents within each half-bridge are suppressed by the use of a dead-band timer. Each INX input contains an independent dead-band timer that is activated on either edge of the input transition. Overcurrent detection circuitry is provided in both the low-side and high-side drivers of each half-bridge output. When activated, the overcurrent detectors trigger an internal timer which causes both half-bridge drivers in the same channel to be modulated at 4% (Typ.) duty cycle. The timer also activates the channel's STATUS output, causing it to be similarly modulated (see Figure 5.) Upon removal of the fault condition, the channel automatically resumes operation in its previously programmed mode and its STATUS output returns to a no-fault state. Recirculation diodes at each OUTX clamp load transients to either VB or PGND and help contain switching currents within each load loop. Overcurrent Duty Cycle Timer A single timer for overcurrent duty cycle is common to both channels. The timer is triggered when a half-bridge in either channel has detected an overcurrent fault. An external capacitor connected to the NCV7702B's CT pin is used to program the period of the timer, and the ratio of two internally fixed currents programs the timer's duty cycle. The capacitor voltage is normally kept at zero by discharge current IDCH. Upon detection of overcurrent, charging current ICHG is switched on and the CT capacitor begins charging from zero towards the timer's upper threshold (VDH.) When the capacitor voltage crosses VDH the faulted channel's outputs are switched off and the channel's STATUS output is switched from VSH to VSL (see Figure 5.) The charging current is switched off, and the capacitor voltage decreases toward the timer's lower (VDL) threshold. Upon crossing the lower threshold, the channel's outputs are switched on and the channel's STATUS output returns to its VSH voltage. This behavior continues until the fault condition is resolved. If the fault condition is resolved before VDH is reached, the timer is reset and no modulation of the previously faulted channel's half-bridge or STATUS outputs occurs. After the timer's initial charge cycle, the output off time is: tOFF = CT (VCH - VDc)/ IDCH. The output on time is: tON = CT (VCH - VDc)/ ICHG. The timer period is: T = tOFF + tON. The value of the CT capacitor is required to be in the range of 470 to 1500 pF. Values below 470 pF may cause timer mis-operation due to internal delays, while values above 1500 pF may cause excessive power dissipation. Connecting the CT pin to ground will prevent operation of the current limit function. Overvoltage and Overtemperature Protection Overvoltage detection circuitry is intended to allow limited operation of the NCV7702B during double-battery conditions. Detection is via the VB1 pin and causes both channels of the IC to be switched off when the detection threshold is exceeded. Hysteresis is provided to improve noise immunity of the overvoltage function. Overtemperature detection circuitry monitors the junction temperature internal to the IC and is intended to ensure reliability by preventing excessive power dissipation. The detection circuitry is centrally located on the IC and causes both channels of the IC to be switched off when the detection threshold is exceeded. Hysteresis is provided to improve noise immunity of the overtemperature function. Both STATUS outputs are switched to the VSL state during either overvoltage or overtemperature faults. Normal operation of the IC is resumed automatically upon resolution the fault, and the STATUS outputs return to the VSH State.
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7
NCV7702B
33 31 29 27 IVB (mA) VSAT (V) 25 23 21 19 17 15 -50 0 50 TEMPERATURE (C) 100 150 VB = 16 V VB = 7 V 2.50 2.48 2.46 2.44 2.42 2.40 -50 VB = 7 V VB = 16 V 2.54 2.52
0
50 TEMPERATURE (C)
100
150
Figure 6. Run Mode Bias Current vs. Temperature
Figure 7. Total VSAT vs. Temperature
MBR2040LT3 VBAT 7 V - 16 V 47 nF
1
1000 mF 50 V VB1 OUT1B
+
24
VB2 OUT2B OUT2A STATUS2 PGND NCV8501 VOUT VIN
+
22 nF
OUT1A STATUS1 PGND
VIGN
PGND PGND NCV7702B PGND PGND PGND IN1A IN1B AGND
12
PGND RESET ENABLE IN2A IN2B CT
13
FLAG MON CT 1.0 nF
DELAY GND
EN1
EN2
Microcontroller
VDD RST I/O
+
Figure 8. Application Diagram
NOTE: Both VB inputs must be connected to the power supply. All PGND pins must be connected to the power supply return (GND). For best thermal performance, the PGND pins should be connected to a thermal plane (heat sink) on the PC board.
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8
NCV7702B
PACKAGE DIMENSIONS
SO-24L DW SUFFIX CASE 751E-04 ISSUE E
-A-
24 13 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 15.25 15.54 7.40 7.60 2.35 2.65 0.35 0.49 0.41 0.90 1.27 BSC 0.23 0.32 0.13 0.29 0_ 8_ 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.601 0.612 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0_ 8_ 0.395 0.415 0.010 0.029
-B-
12X
P 0.010 (0.25)
M
B
M
1
12
24X
D 0.010 (0.25)
M
J TA
S
B
S
F R C -T-
SEATING PLANE X 45 _
M
22X
G
K
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NCV7702B
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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10
NCV7702B/D


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